Nobuya Takahashi is a prominent inventor based in Ogaki, Japan. He has made significant contributions to the field of printed wiring board technology, holding a total of 10 patents. His innovative designs and methods have advanced the capabilities of electronic components and their interconnections.

Latest Patents

Takahashi's latest patents include a printed wiring board that features an insulation layer with conductive pads designed to connect electronic components. This design incorporates a conductive wiring pattern that consists of first and second conductive patterns, which are alternately arrayed on the insulation layer. Each wiring line is equipped with a metal layer that differs from the metal material of the adjacent lines. Another notable patent is for a printed wiring board and method for manufacturing it, which includes an insulating layer and a conductor layer with pads and patterns. The conductor patterns are meticulously designed to have a pattern width and interval of 3 µm or less, ensuring high precision in electronic connections.

Career Highlights

Takahashi is currently employed at Ibiden Company Limited, where he continues to innovate in the field of printed wiring boards. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

Throughout his career, Takahashi has collaborated with talented individuals such as Toshiki Furutani and Daiki Komatsu. These collaborations have fostered a creative environment that has led to groundbreaking advancements in their field.

Conclusion

Nobuya Takahashi's contributions to printed wiring board technology exemplify his dedication to innovation and excellence. His patents reflect a deep understanding of electronic design and manufacturing processes, making him a key figure in the industry.

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