The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

May. 16, 2013
Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Yoshinori Shizuno, Gifu, JP;

Nobuya Takahashi, Gifu, JP;

Hisayuki Nakagome, Gifu, JP;

Asuka Ii, Gifu, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 25/18 (2006.01); H01L 23/13 (2006.01); H01L 21/56 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/76802 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 25/18 (2013.01); H01L 23/13 (2013.01); H01L 21/563 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15192 (2013.01); H05K 1/11 (2013.01); H05K 3/4602 (2013.01); H05K 3/4644 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/81192 (2013.01); H05K 2201/10522 (2013.01);
Abstract

A wiring board includes a first insulation layer, a first conducive layer having first conductive patterns formed on the first insulation layer, a wiring structure positioned on the first insulation layer and including a second insulation layer and a second conductive layer having second conductive patterns formed on the second insulation layer, multiple conductive patterns formed on the wiring structures such that the conductive patterns are connected to the second conductive patterns, respectively, multiple first electrodes formed on the first conductive patterns, respectively, and multiple second electrodes formed on the conductive patterns connected to the second conductive patterns of the wiring structure, respectively. The first electrodes and the second electrodes have top surfaces which form the same plane.


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