Location History:
- Gifu, JP (2015)
- Ogaki, JP (2016)
Company Filing History:
Years Active: 2015-2016
Title: Asuka Ii: Innovator in Wiring Technology
Introduction
Asuka Ii is a prominent inventor based in Ogaki, Japan. She has made significant contributions to the field of wiring technology, holding a total of 3 patents. Her innovative work has paved the way for advancements in electronic components and multilayer printed wiring boards.
Latest Patents
Asuka Ii's latest patents include a wiring board and a method for manufacturing the same. This wiring board features a first interlayer insulation layer and a second interlayer insulation layer with an opening portion. It also includes first conductive pads on the second interlayer insulation layer and a conductive plane layer that is exposed by the opening portion. Additionally, a wiring structure is positioned directly on the conductive plane layer, accommodating the opening portion, with second conductive pads formed on the wiring structure.
Another notable patent is for an electronic component that consists of an insulation layer, an alignment mark on its first surface, and an adhesive layer containing an optically opaque agent. This adhesive layer can be formed on either the first or second surface of the insulation layer, with an opening portion that exposes the alignment mark.
Career Highlights
Asuka Ii is currently employed at Ibiden Company Limited, where she continues to innovate and develop new technologies. Her work has been instrumental in enhancing the efficiency and functionality of electronic components.
Collaborations
Asuka has collaborated with notable coworkers, including Yoshinori Shizuno and Nobuya Takahashi. These partnerships have contributed to her success and the advancement of her projects.
Conclusion
Asuka Ii is a remarkable inventor whose contributions to wiring technology have had a lasting impact. Her innovative patents and collaborations reflect her dedication to advancing the field of electronics.