Ibiden Company Limited

Asuka Ii

Yoshinori Shizuno

Nobuya Takahashi

Hisayuki Nakagome

Masatoshi Kunieda

Makoto Terui

A wiring board includes a first interlayer insulation layer, a second interlayer insulation layer formed on the first interlayer insulation layer and having an opening portion, first conductive pads formed on the second interlayer insulation layer, a conductive plane layer formed on the first interlayer insulation layer such that the conductive plane layer is exposed by the opening portion of the second interlayer insulation layer, a wiring structure positioned directly on the conductive plane layer such that the wiring structure is accommodated in the opening portion of the second interlayer insulation layer, and second conductive pads formed on the wiring structure such that the first conductive pads and the second conductive pads are set to be positioned on a same plane.

Wiring board and method for manufacturing the same

An electronic component includes an insulation layer, an alignment mark positioned on a first surface of the insulation layer, and an adhesive layer including an optically opaque agent and formed on the first surface of the insulation layer or a second surface of the insulation layer on the opposite side with respect to the first surface of the insulation layer. The adhesive layer has an opening portion formed at the position corresponding to the alignment mark such that the opening portion exposes the alignment mark directly or through the insulation layer.

Electronic component, method for manufacturing the same and method for manufacturing multilayer printed wiring board

A wiring board includes a first insulation layer, a first conducive layer having first conductive patterns formed on the first insulation layer, a wiring structure positioned on the first insulation layer and including a second insulation layer and a second conductive layer having second conductive patterns formed on the second insulation layer, multiple conductive patterns formed on the wiring structures such that the conductive patterns are connected to the second conductive patterns, respectively, multiple first electrodes formed on the first conductive patterns, respectively, and multiple second electrodes formed on the conductive patterns connected to the second conductive patterns of the wiring structure, respectively. The first electrodes and the second electrodes have top surfaces which form the same plane.

Growing community of inventors

Ogaki, Japan

Asuka Ii