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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9480157 B1

PDFFull Text
Date of Patent:
Oct. 25, 2016

Filed:

Apr. 07, 2015

Wiring board and method for manufacturing the same

Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Yoshinori Shizuno, Ogaki, JP;

Nobuya Takahashi, Ogaki, JP;

Hisayuki Nakagome, Ogaki, JP;

Asuka Ii, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Roy Potter

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 25/18 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H01L 23/13 (2006.01); H01L 21/56 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 21/76802 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 25/18 (2013.01); H05K 1/0298 (2013.01); H05K 1/032 (2013.01); H05K 1/115 (2013.01); H05K 3/465 (2013.01); H05K 3/4652 (2013.01); H01L 21/563 (2013.01); H01L 23/13 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81192 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H05K 1/11 (2013.01); H05K 3/4602 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/10522 (2013.01); H05K 2203/06 (2013.01); H05K 2203/1453 (2013.01); Y10T 156/10 (2015.01);
Abstract

A wiring board includes a first interlayer insulation layer, a second interlayer insulation layer formed on the first interlayer insulation layer and having an opening portion, first conductive pads formed on the second interlayer insulation layer, a conductive plane layer formed on the first interlayer insulation layer such that the conductive plane layer is exposed by the opening portion of the second interlayer insulation layer, a wiring structure positioned directly on the conductive plane layer such that the wiring structure is accommodated in the opening portion of the second interlayer insulation layer, and second conductive pads formed on the wiring structure such that the first conductive pads and the second conductive pads are set to be positioned on a same plane.

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