The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2013
Filed:
Sep. 28, 2011
Toshiki Furutani, Ogaki, JP;
Daiki Komatsu, Ogaki, JP;
Nobuya Takahashi, Ogaki, JP;
Masatoshi Kunieda, Ogaki, JP;
Naomi Fujita, Ogaki, JP;
Koichi Tsunoda, Ogaki, JP;
Minetaka Oyama, Ogaki, JP;
Toshimasa Yano, Ogaki, JP;
Toshiki Furutani, Ogaki, JP;
Daiki Komatsu, Ogaki, JP;
Nobuya Takahashi, Ogaki, JP;
Masatoshi Kunieda, Ogaki, JP;
Naomi Fujita, Ogaki, JP;
Koichi Tsunoda, Ogaki, JP;
Minetaka Oyama, Ogaki, JP;
Toshimasa Yano, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A wiring board including a core substrate made of an insulative material and having a penetrating portion, a first interlayer insulation layer formed on the surface of the core substrate, a first conductive circuit formed on the surface of the first interlayer insulation layer, a first via conductor formed in the first interlayer insulation layer, and an electronic component accommodated in the penetrating portion of the core substrate and including a semiconductor element, a bump body mounted on the semiconductor element, a conductive circuit connected to the bump body, an interlayer resin insulation layer formed on the conductive circuit, and a via conductor formed in the interlayer resin insulation layer. The first via conductor has a tapering direction which is opposite of a tapering direction of the via conductor in the electronic component.