Ogaki, Japan

Minetaka Oyama

USPTO Granted Patents = 1 

Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Minetaka Oyama: Innovator in Wiring Board Technology

Introduction

Minetaka Oyama is a notable inventor based in Ogaki, Japan. He has made significant contributions to the field of electronics, particularly in the development of advanced wiring board technology. His innovative designs have paved the way for improved electronic components and systems.

Latest Patents

Oyama holds a patent for a wiring board that features a core substrate made of an insulative material. This wiring board includes a penetrating portion, a first interlayer insulation layer, and a first conductive circuit. Additionally, it incorporates a first via conductor and an electronic component that contains a semiconductor element. The design also features a bump body mounted on the semiconductor element, a conductive circuit connected to the bump body, and an interlayer resin insulation layer. The first via conductor is uniquely designed with a tapering direction that is opposite to that of the via conductor in the electronic component. This innovative approach enhances the functionality and efficiency of electronic devices.

Career Highlights

Minetaka Oyama is currently employed at Ibiden Company Limited, where he continues to work on cutting-edge technologies in the electronics sector. His expertise and innovative mindset have made him a valuable asset to the company.

Collaborations

Throughout his career, Oyama has collaborated with talented individuals such as Toshiki Furutani and Daiki Komatsu. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Minetaka Oyama's contributions to wiring board technology exemplify the spirit of innovation in the electronics industry. His patent and ongoing work at Ibiden Company Limited highlight his commitment to advancing technology and improving electronic components.

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