The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Jul. 30, 2015
Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventor:

Nobuya Takahashi, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/18 (2006.01); H05K 3/16 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/40 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H05K 3/18 (2013.01); H01L 23/49866 (2013.01); H01L 23/5386 (2013.01); H01L 24/17 (2013.01); H05K 1/09 (2013.01); H05K 3/16 (2013.01); H01L 21/4857 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H05K 1/111 (2013.01); H05K 1/141 (2013.01); H05K 3/4007 (2013.01); H05K 2201/0391 (2013.01); H05K 2201/0769 (2013.01); H05K 2201/094 (2013.01); H05K 2201/097 (2013.01); H05K 2201/098 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09736 (2013.01);
Abstract

A printed wiring board includes an insulation layer, conductive pads formed on the insulation layer and positioned to connect an electronic component, and a conductive wiring pattern including first and second conductive patterns and formed on the insulation layer such that the conductive wiring pattern is extending between the conductive pads. The first pattern includes first wiring lines, the second pattern includes second wiring lines, the first and second conductive patterns are formed such that the first wiring lines and the second wiring lines are alternately arrayed on the insulation layer, each of the first wiring lines includes a first metal layer formed on an interface with the insulation layer, each of the second wiring lines includes a second metal layer formed on an interface with the insulation layer, and the first metal layer includes a metal material which is different from a metal material forming the second metal layer.


Find Patent Forward Citations

Quick Actions:

Takahashi, Nobuya. (2017). Printed wiring board (U.S. Patent No. 9736945). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9736945

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…