The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

May. 22, 2015
Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Toshiki Furutani, Ogaki, JP;

Daiki Komatsu, Ogaki, JP;

Nobuya Takahashi, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/28 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 21/568 (2013.01); H01L 21/76804 (2013.01); H01L 21/78 (2013.01); H01L 23/28 (2013.01); H01L 23/29 (2013.01); H01L 23/293 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5226 (2013.01); H01L 23/562 (2013.01); H01L 24/97 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01);
Abstract

An electronic component including a wiring board having interlayer insulation layers and conductive patterns, the wiring board having a first surface and a second surface on the opposite side of the first surface, multiple first bumps formed on a first conductive pattern positioned on the first surface of the wiring board among the conductive patterns of the wiring board, a semiconductor element mounted on the first surface of the wiring board through the first bumps, an encapsulating resin encapsulating the semiconductor element and at least a portion of a side surface of the wiring board, the side surface of the wiring board extending between the first surface and second surface of the wiring board, and multiple of second bumps formed on the second surface of the wiring board and connected to a second conductive pattern of the conductive patterns in the wiring board.


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