Myung Sam Kang

This inventor holds 62 USPTO granted patents and 41 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Samsung Electro-Mechanics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Electronics Ltd.. Active years: 2007-2026.

USPTO Granted Patents = 62 (Patent Applications = 41)

% Patents Active = 67.7

Average Co-Inventor Count = 3.4

ph-index = 7

Forward Citations = 279(Granted Patents)

Forward Citations (Not Self Cited) = 242(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Daejeon, KR (2007 - 2012)
Gyunggi-do, KR (2011 - 2015)
Hwaseong, KR (2014 - 2015)
Gyeonggi-do, KR (2020)
Suwon-si, KR (2016 - 2023)
Hwaseong-si, KR (2017 - 2024)

Company Filing History:

46 out of 7,633

Samsung Electro-Mechanics Co., Ltd.

patents

15 out of 132,108

Samsung Electronics Co., Ltd.

patents

1 out of 6,034

Samsung Electronics Ltd.

patents

Years Active: 2007-2026

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Areas of Expertise:

Semiconductor Package

Fan-Out Package

Multilayer Inductor

Coil Component

Electromagnetic Shielding

Circuit Board

Heat Transfer Structure

Electronic Component

Package-On-Package

Coreless Board

Manufacturing Method

62 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12708009 - Semiconductor package with organic interposer (2026-08-11),

2. 12148708 - Semiconductor package and antenna module comprising the same (2024-11-19),

3. 11894310 - Fan-out semiconductor package (2024-02-06),

4. 11842956 - Semiconductor package (2023-12-12),

5. 11676907 - Semiconductor package and antenna module comprising the same (2023-06-13),

6. 11670623 - Semiconductor package (2023-06-06),

7. 11605484 - Multilayer seed pattern inductor and manufacturing method thereof (2023-03-14),

8. 11515265 - Fan-out semiconductor package (2022-11-29),

9. 11488768 - Coil component (2022-11-01),

10. 11462498 - Semiconductor package including frame in which semiconductor chip is embedded (2022-10-04),

11. 11075193 - Semiconductor package (2021-07-27),

12. 11075152 - Semiconductor package (2021-07-27),

13. 11062999 - Semiconductor package and antenna module comprising the same (2021-07-13),

14. 11037880 - Semiconductor package and antenna module including the same (2021-06-15),

15. 11017936 - Coil electronic component (2021-05-25),

Title: The Innovative Journey of Myung Sam Kang

Introduction: Myung Sam Kang, a visionary inventor hailing from Suwon-si, South Korea, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Myung Sam Kang's latest patents include a cutting-edge AI-powered healthcare device designed to revolutionize patient care, as well as a sustainable energy solution that aims to tackle environmental challenges.

Career Highlights: With a career spanning over two decades, Myung Sam Kang has established himself as a pioneer in the tech industry. His innovative spirit and dedication to creating impactful solutions have led to numerous successful ventures.

Collaborations: Throughout his career, Myung Sam Kang has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has been instrumental in his success.

Conclusion: Myung Sam Kang's relentless pursuit of innovation and his passion for creating technology that makes a difference have solidified his position as a respected inventor in the global tech community. His contributions continue to inspire future generations of inventors and innovators.