The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Aug. 28, 2019
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Yong Jin Park, Suwon-si, KR;
Sang Kyu Lee, Suwon-si, KR;
Moon Il Kim, Suwon-si, KR;
Myung Sam Kang, Suwon-si, KR;
Jeong Ho Lee, Suwon-si, KR;
Young Gwan Ko, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a frame having a wiring structure and having a recess portion, a semiconductor chip having an active surface with a connection pad disposed thereon and disposed in the recess portion, an encapsulant sealing the semiconductor chip, and a redistribution layer having a first via connected to the connection and a second via connected to a portion of the wiring structure. The semiconductor chip includes a protective insulating film disposed on the active surface and having an opening exposing a region of the connection pad, and a redistribution capping layer connected to the region of the connection pad and extending onto the protective insulating film, and a surface of the redistribution capping layer is substantially the same level as a surface of the portion of the wiring structure, exposed from the first surface.