The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2021
Filed:
Dec. 16, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Myung Sam Kang, Suwon-si, KR;
Bong Ju Cho, Suwon-si, KR;
Young Gwan Ko, Suwon-si, KR;
Moon Il Kim, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a first connection member including a first redistribution layer, a first frame disposed on the first connection member, a first semiconductor chip disposed on a first through-portion and having a connection pad, a first encapsulant covering a portion of each of the first frame and the first semiconductor chip and filling at least a portion of the first through-portion, a second connection member disposed on the first encapsulant and including a second redistribution layer, a second semiconductor chip disposed on the second connection member and having a second connection pad, a second encapsulant covering a portion of the second semiconductor chip, and a first through-via penetrating through the first frame, the first encapsulant, and a portion of the first connection member, and electrically connecting the first and second redistribution layers to each other.