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For the Inventor, By the Inventor

Hsinchu, Taiwan

Min-Lin Lee

This inventor holds 44 USPTO granted patents and 1 published patent application, primarily in Circuit Board Technology. Top assignees: Industrial Technology Research Institute, First Hi-Tec Enterprise Co., Ltd., Nexcom International Co., Ltd.. Active years: 2004-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Min-Lin Lee. Retrieved from https://idiyas.com/inventor/min-lin-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 44 

% Patents Active = 86.4

Average Co-Inventor Count = 4.1

ph-index = 7

Forward Citations = 243(Granted Patents)


Location History:

  • Chutung Hsinchu, TW (2008 - 2010)
  • Hsinchu, TW (2004 - 2020)

Company Filing History:

goldMedal44 out of 9,307 
 
Industrial Technology Research Institute
 patents
silverMedal3 out of 4 
 
First Hi-Tec Enterprise Co., Ltd.
 patents
bronzeMedal3 out of 15 
 
Nexcom International Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2004-2024

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Areas of Expertise:
Circuit Board
Embedded Capacitors
Multi-Layer Structure
Signal Transmission
Capacitor Devices
Via Structure
Interconnect Structure
Decoupling Device
Power Device Package
Electrically Conductive Structure
Composite Substrate
ESD Protection
44 patents (USPTO):Explore Patents
1. 12185456 - Circuit board with rigid portion and flexible portion having connecting end and electronic package using the same (2024-12-31),
2. 10559534 - Circuit substrate (2020-02-11),
3. 10129974 - Multi-layer circuit structure (2018-11-13),
4. 9706656 - Signal transmission board and method for manufacturing the same (2017-07-11),
5. 9258883 - Via structure (2016-02-09),
6. 9125304 - Circuit board having via and manufacturing method thereof (2015-09-01),
7. 9030808 - Solid electrolytic capacitor and circuit board having the same (2015-05-12),
8. 9029984 - Semiconductor substrate assembly (2015-05-12),
9. 9013893 - Embedded capacitor module (2015-04-21),
10. 8941015 - Embedded capacitor substrate module (2015-01-27),
11. 8525328 - Power device package structure (2013-09-03),
12. 8488299 - Capacitor structure (2013-07-16),
13. 8304666 - Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof (2012-11-06),
14. 8289679 - Decoupling device (2012-10-16),
15. 8237520 - Capacitor devices with a filter structure (2012-08-07),

Title: The Innovative Journey of Min-Lin Lee

Introduction: Min-Lin Lee, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Min-Lin Lee's latest patents showcase his continuous dedication to innovation, with a focus on cutting-edge technologies in the semiconductor industry and beyond.

Career Highlights: Throughout his illustrious career, Min-Lin Lee has been at the forefront of technological advancements, leading research and development teams to create revolutionary products that have shaped the industry.

Collaborations: Min-Lin Lee has collaborated with leading tech companies, research institutions, and universities worldwide, fostering a culture of innovation and knowledge sharing to drive progress in the field.

Conclusion: Min-Lin Lee's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor, inspiring the next generation of innovators to push the boundaries of what is possible in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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