The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2015

Filed:

May. 17, 2013
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Chien-Min Hsu, Hsinchu County, TW;

Min-Lin Lee, Hsinchu, TW;

Cheng-Liang Cheng, Hsinchu, TW;

Li-Duan Tsai, Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H01L 23/50 (2006.01); H01L 23/00 (2006.01); H05K 3/46 (2006.01); H01G 4/33 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 23/49822 (2013.01); H01L 23/642 (2013.01); H01L 24/16 (2013.01); H05K 1/0231 (2013.01); H05K 1/162 (2013.01); H05K 3/4608 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/09309 (2013.01); H05K 2203/0315 (2013.01); H01L 2224/16225 (2013.01); H05K 2201/0116 (2013.01); H01L 23/50 (2013.01); H01G 4/33 (2013.01);
Abstract

An embedded capacitor module includes an electrode lead-out portion and at least one solid electrolytic capacitor portion adjacently disposed with the electrode lead-out portion. The electrode lead-out portion comprises a first substrate, a second substrate, a first insulating material disposed between the first substrate and the second substrate, a first porous layer formed on at least one surface of the first substrate, and a first oxide layer disposed on the first porous layer. The solid electrolytic capacitor portion comprises the first substrate, the second substrate, the first porous layer, the first oxide layer, all of which are extended from the electrode lead-out portion, a first conductive polymer layer disposed on the first oxide layer, a first carbon layer disposed on the first conductive polymer layer, and a first conductive adhesive layer disposed on the first carbon layer.


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