The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2012

Filed:

May. 10, 2010
Applicants:

Cheng-liang Cheng, Hsinchu, TW;

Chi-lun Chen, Taipei, TW;

Li-duan Tsai, Hsinchu, TW;

Min-lin Lee, Hsinchu, TW;

Shur-fen Liu, Hsinchu County, TW;

Inventors:

Cheng-Liang Cheng, Hsinchu, TW;

Chi-Lun Chen, Taipei, TW;

Li-Duan Tsai, Hsinchu, TW;

Min-Lin Lee, Hsinchu, TW;

Shur-Fen Liu, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 5/38 (2006.01); H01G 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A decoupling device includes a lead frame, a capacitor unit, a metal layer, and a high dielectric organic-inorganic composite material layer. The lead frame includes a cathode terminal portion and an anode terminal portion. The capacitor unit is disposed on the lead frame. The capacitor unit includes a cathode portion, an anode portion, and an insulation portion located between the cathode portion and the anode portion. The cathode portion is electrically connected to the cathode terminal portion, and the anode portion is electrically connected to the anode terminal portion. The high dielectric organic-inorganic composite material layer is connected to the capacitor unit in parallel via the metal layer.


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