The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Aug. 03, 2011
Chien-min Hsu, Hsinchu County, TW;
Min-lin Lee, Hsinchu, TW;
Cheng-liang Cheng, Hsinchu, TW;
Li-duan Tsai, Hsinchu, TW;
Chien-Min Hsu, Hsinchu County, TW;
Min-Lin Lee, Hsinchu, TW;
Cheng-Liang Cheng, Hsinchu, TW;
Li-Duan Tsai, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
An embedded capacitor substrate module includes a substrate, a metal substrate and a solid electrolytic capacitor material. The solid electrolytic capacitor material is formed on the metal substrate, so as to form a solid electrolytic capacitor with the substrate. The embedded capacitor substrate module further includes an electrode lead-out region formed by extending the substrate and the metal substrate. The metal substrate serves as a first electrode, and the substrate serves as a second electrode. An insulating material is formed between the substrate and the metal substrate. Therefore, the embedded capacitor substrate module is not only advantageous in having a large capacitance as the conventional solid capacitor, but also capable of being drilled or plated and electrically connected to other circuits after being embedded in a printed circuit board.