The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Dec. 29, 2021
First Hi-tec Enterprise Co., Ltd., Taoyuan, TW;
Nexcom International Co., Ltd., New Taipei, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Min-Lin Lee, Hsinchu, TW;
Sheng-Che Hung, Hsinchu County, TW;
Ching-Shan Chang, New Taipei, TW;
Ying-Tsuen Liou, New Taipei, TW;
First Hi-tec Enterprise Co., Ltd., Taoyuan, TW;
NEXCOM International Co., Ltd., New Taipei, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A circuit board and an electronic package using the same are provided. The circuit board includes a rigid board body, at least one bendable extension portion, connecting members, and shielding members. The rigid board body includes conductive layers and dielectric layers therebetween. The extension portion is connected to a side of the rigid board body and formed by layers of the conductive layers and at least one layer of the dielectric layers extending outside the rigid board body. The connecting members are arranged on a connecting end of the extension portion and electrically connected to a signal layer of the conductive layers. The shielding members are arranged around the corresponding connecting members and electrically connected to a ground layer of the conductive layers. The connecting members and the shielding members protrude from the connecting end. A height of the shielding members is lower than a height of the connecting members.