The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Aug. 02, 2018
Industrial Technology Research Institute, Hsinchu, TW;
First Hi-tec Enterprise Co., Ltd., Taoyuan, TW;
Nexcom International Co., Ltd., New Taipei, TW;
Sheng-Che Hung, Changhua County, TW;
Min-Lin Lee, Hsinchu, TW;
Ching-Shan Chang, New Taipei, TW;
Hung-I Liu, New Taipei, TW;
Industrial Technology Research Institute, Hsinchu, TW;
First Hi-tec Enterprise Co., Ltd., Taoyuan, TW;
NEXCOM International Co., Ltd., New Taipei, TW;
Abstract
A circuit substrate includes a dielectric layer, a first conductive structure and a second conductive structure. The first conductive structure includes a first conductive circuit and a first conductive via. The first conductive circuit is disposed on the dielectric layer. The first conductive via is disposed in the dielectric layer, and the first conductive circuit is connected to the first conductive via. The second conductive structure includes a second conductive circuit and a second conductive via. The second conductive circuit is disposed in the dielectric layer, the second conductive circuit and the first conductive circuit of the first conductive structure are arranged with an interval, and the second conductive via surrounds the first conductive via with an interval. The second conductive structure has an extending portion. The extending portion protrudes toward the first conductive via and does not contact the first conductive via.