The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2012

Filed:

May. 19, 2009
Applicants:

Cheng-ta Ko, Hsinchu, TW;

Min-lin Lee, Hsinchu, TW;

Wei-chung Lo, Taipei County, TW;

Shur-fen Liu, Hsinchu County, TW;

Jinn-shing King, Hsinchu, TW;

Shinn-juh Lai, Hsinchu County, TW;

Yu-hua Chen, Nantou County, TW;

Inventors:

Cheng-Ta Ko, Hsinchu, TW;

Min-Lin Lee, Hsinchu, TW;

Wei-Chung Lo, Taipei County, TW;

Shur-Fen Liu, Hsinchu County, TW;

Jinn-Shing King, Hsinchu, TW;

Shinn-Juh Lai, Hsinchu County, TW;

Yu-Hua Chen, Nantou County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.


Find Patent Forward Citations

Quick Actions:

Ko, Cheng-Ta. (2012). Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof (U.S. Patent No. 8304666). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8304666

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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