Company Filing History:

14 out of 164,197

International Business Machines Corporation

patents

1 out of 10,326

Tokyo Electron Limited

patents

where one patent can have more than one assignee

Years Active: 2004-2013

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14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8492295 - On-chip cooling for integrated circuits (2013-07-23),

2. 8298966 - On-chip cooling systems for integrated circuits (2012-10-30),

3. 8008209 - Thermal gradient control of high aspect ratio etching and deposition processes (2011-08-30),

4. 7859013 - Metal oxide field effect transistor with a sharp halo (2010-12-28),

5. 7754615 - Method and apparatus for detecting endpoint in a dry etching system by monitoring a superimposed DC current (2010-07-13),

6. 7659616 - On-chip cooling systems for integrated circuits (2010-02-09),

7. 7384835 - Metal oxide field effect transistor with a sharp halo and a method of forming the transistor (2008-06-10),

8. 7285775 - Endpoint detection for the patterning of layered materials (2007-10-23),

9. 7278300 - Gas filled reactive atomic force microscope probe (2007-10-09),

10. 7256399 - Non-destructive in-situ elemental profiling (2007-08-14),

11. 7119333 - Ion detector for ion beam applications (2006-10-10),

12. 6900137 - Dry etch process to edit copper lines (2005-05-31),

13. 6843893 - Metal dry etch using electronic field (2005-01-18),

14. 6730237 - Focused ion beam process for removal of copper (2004-05-04),

Title: Michael Ray Sievers: Innovator in On-Chip Cooling Technologies

Introduction

Michael Ray Sievers is a prominent inventor based in Poughkeepsie, NY (US). He holds a total of 14 patents that showcase his contributions to the field of semiconductor technology. His innovative work primarily focuses on on-chip cooling systems for integrated circuits, which are crucial for enhancing the performance and reliability of electronic devices.

Latest Patents

Among his latest patents, Sievers has developed groundbreaking technologies such as "On-chip cooling for integrated circuits" and "On-chip cooling systems for integrated circuits." The first patent describes a semiconductor structure that includes a substrate, a transistor, and multiple interconnect layers. It features a unique cooling pipes system that operates without any solid or liquid material, ensuring efficient heat management. The second patent further elaborates on the cooling pipes system, emphasizing its design that allows for continuous paths within the system, enhancing its effectiveness in maintaining optimal temperatures for semiconductor chips.

Career Highlights

Throughout his career, Michael Ray Sievers has worked with notable companies, including IBM and Tokyo Electron Limited. His experience in these leading organizations has significantly contributed to his expertise in semiconductor technologies and innovation.

Collaborations

Sievers has collaborated with esteemed colleagues such as Richard Stephan Wise and Steven B Herschbein, further enriching his work and contributions to the field.

Conclusion

Michael Ray Sievers stands out as a key figure in the development of advanced cooling technologies for integrated circuits. His innovative patents and collaborations reflect his commitment to enhancing semiconductor performance and reliability.

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