The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Oct. 10, 2007
Kaushik A. Kumar, Beacon, NY (US);
Andres Fernando Munoz, Yonkers, NY (US);
Michael Ray Sievers, Poughkeepsie, NY (US);
Richard Stephen Wise, Newburgh, NY (US);
Kaushik A. Kumar, Beacon, NY (US);
Andres Fernando Munoz, Yonkers, NY (US);
Michael Ray Sievers, Poughkeepsie, NY (US);
Richard Stephen Wise, Newburgh, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. The cooling pipes system does not include any solid or liquid material. Given any first point and any second point in the cooling pipes system, there exists a continuous path which connects the first and second points and which is totally within the cooling pipes system. A first portion of the cooling pipes system overlaps the transistor. A second portion of the cooling pipes system is higher than the substrate and lower than a top interconnect layer. The second portion is in direct physical contact with a surrounding ambient.