Michael Harper

This inventor holds 19 USPTO granted patents and 8 published patent applications, plus 2 CIPO patents, primarily in Integrated Circuit Design. Top assignee: Intel Corporation. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael Harper. Retrieved from https://idiyas.com/inventor/michael-harper-3fgxu5g6

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 (Patent Applications = 8)

% Patents Active = 78.9

CIPO Patents = 2 (Patent Applications = 1)

Average Co-Inventor Count = 4.7

ph-index = 3

Forward Citations = 51(Granted Patents)

Company Filing History:

19 out of 56,322

Intel Corporation

patents

Years Active: 2011-2026

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Areas of Expertise:

Gate-All-Around Structures

Dual Metal Gates

Non-Planar Transistors

Trigate Transistor

Vertical Edge Blocking

CMOS Transistors

Feature Size Reduction

Substrate Fins

Masking Layers

Stacked Nanoribbon Devices

19 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12745416 - Gate-all-around integrated circuit structures having fin stack isolation (2026-09-22),

2. 12457771 - Plug and recess process for dual metal gate on stacked nanoribbon devices (2025-10-28),

3. 12369392 - Fabrication of gate-all-around integrated circuit structures having pre-spacer deposition cut gates (2025-07-22),

4. 12068314 - Fabrication of gate-all-around integrated circuit structures having adjacent island structures (2024-08-20),

5. 12046652 - Plug and recess process for dual metal gate on stacked nanoribbon devices (2024-07-23),

6. 11990472 - Fabrication of gate-all-around integrated circuit structures having pre-spacer deposition cut gates (2024-05-21),

7. 11972979 - 1D vertical edge blocking (VEB) via and plug (2024-04-30),

8. 11721580 - 1D vertical edge blocking (VEB) via and plug (2023-08-08),

9. 11594637 - Gate-all-around integrated circuit structures having fin stack isolation (2023-02-28),

10. 11569231 - Non-planar transistors with channel regions having varying widths (2023-01-31),

11. 9916988 - Sacrificial material for stripping masking layers (2018-03-13),

12. 9905693 - Trigate transistor structure with unrecessed field insulator and thinner electrodes over the field insulator (2018-02-27),

13. 9768249 - Trigate transistor structure with unrecessed field insulator and thinner electrodes over the field insulator (2017-09-19),

14. 8629039 - Substrate fins with different heights (2014-01-14),

15. 8441074 - Substrate fins with different heights (2013-05-14),

Title: The Innovative Journey of Inventor Michael Harper

Introduction

Michael Harper, an accomplished inventor based in Hillsboro, Oregon, has made significant contributions to the field of integrated circuit technology. With a remarkable portfolio of 17 patents, he continues to push the boundaries of innovation, particularly through his work at Intel Corporation.

Latest Patents

Among his latest inventions, Harper has been instrumental in developing groundbreaking gate-all-around integrated circuit structures. One of his notable patents focuses on the fabrication of these structures, featuring pre-spacer deposition cut gates. This innovative design incorporates a first vertical arrangement of horizontal nanowires alongside a second vertical arrangement, with carefully spaced gate stacks to optimize performance.

Another significant patent involves the creation of gate-all-around integrated circuit structures with adjacent island structures. This design includes a semiconductor island located between two vertical arrangements of horizontal nanowires, ensuring that electrical isolation is maintained from the substrate fins beneath. These advancements reflect Harper's commitment to enhancing integrated circuit efficiency and functionality.

Career Highlights

During his tenure at Intel Corporation, Michael Harper has exemplified the essence of innovation. His numerous patents highlight his expertise and dedication to advancing semiconductor technology. Each invention represents his prowess in solving complex engineering challenges, laying the groundwork for future developments in the field.

Collaborations

Harper has collaborated with esteemed colleagues, including Leonard P. Guler and Willy Rachmady, further enriching his experience and knowledge in the industry. These partnerships have allowed for the exchange of ideas and techniques, contributing to the successful realization of their innovative projects.

Conclusion

Michael Harper stands out as a pivotal figure in the realm of integrated circuits, with a record of impressive patents that showcase his dedication to innovation. His work at Intel Corporation continues to pave the way for advancements in technology, ensuring that he remains a significant contributor to the future of engineering and invention.

Profile summary based on public USPTO records.