The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

Sep. 25, 2013
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Shakuntala Sundararajan, Hillsboro, OR (US);

Nadia Rahhal-Orabi, Lake Oswego, OR (US);

Leonard P Guler, Hillsboro, OR (US);

Michael Harper, Hillsboro, OR (US);

Ralph Thomas Troeger, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/02 (2006.01); H01L 21/8234 (2006.01); H01L 21/033 (2006.01); H01L 21/3105 (2006.01); H01L 27/088 (2006.01); H01L 29/06 (2006.01); H01L 29/40 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31144 (2013.01); H01L 21/02282 (2013.01); H01L 21/0332 (2013.01); H01L 21/31051 (2013.01); H01L 21/76814 (2013.01); H01L 21/823437 (2013.01); H01L 27/088 (2013.01); H01L 29/0657 (2013.01); H01L 29/401 (2013.01);
Abstract

Techniques and structures for protecting etched features during etch mask removal. In embodiments, a mask is patterned and a substrate layer etched to transfer the pattern. Subsequent to etching the substrate layer, features patterned into the substrate are covered with a sacrificial material backfilling the etch mask. At least a top portion of the mask is removed with the substrate features protected by the sacrificial material. The sacrificial material and any remaining portion of the mask are then removed. In further embodiments, a gate contact opening etched into a substrate layer is protected with a sacrificial material having the same composition as a first material layer of a multi-layered etch mask. A second material layer of the etch mask having a similar composition as the substrate layer is removed before subsequently removing the sacrificial material concurrently with the first mask material layer.


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