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For the Inventor, By the Inventor

Boise, ID, United States of America

Michael A Smith

This inventor holds 86 USPTO granted patents and 35 published patent applications and 1 EPO patent, primarily in Semiconductor Devices (CPC class G11C16-0483). Top assignees: Micron Technology Incorporated, Intel Corporation, Round Rock Research, LLC. Active years: 1998-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael A Smith. Retrieved from https://idiyas.com/inventor/michael-a-smith-k4ncs8hv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 86 

% Patents Active = 91.9

 

Average Co-Inventor Count = 1.5

ph-index = 9

Forward Citations = 595(Granted Patents)

Forward Citations (Not Self Cited) = 499(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Westerly, RI (US) (1998)
  • Orland, CA (US) (2002)
  • Folsom, CA (US) (2016)
  • Boise, TX (US) (2021)
  • Boise, ID (US) (2005 - 2024)

Company Filing History:

goldMedal76 out of 39,176 
 
Micron Technology Incorporated
 patents
silverMedal5 out of 56,290 
 
Intel Corporation
 patents
bronzeMedal2 out of 428 
 
Round Rock Research, LLC
 patents
4. 1 out of 218 
 
Lodestar Licensing Group LLC
 patents
where one patent can have more than one assignee

Years Active: 1998-2026

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Areas of Expertise:
Memory Subsystem
Transistor
High Voltage Isolation
Circuit Protection
Integrated Circuit
Active Protection
Dielectric Materials
Stack Structures
Microelectronic Devices
Three-Dimensional Memory
86 patents (USPTO):Explore Patents
1. 12676194 - Interfaces between higher voltage and lower voltage wafers and related apparatuses and methods (2026-07-07),
2. 12400956 - Reduced pitch memory subsystem for memory device (2025-08-26),
3. 12342563 - Transistor with gate attached field plate (2025-06-24),
4. 12278286 - High voltage isolation devices for semiconductor devices (2025-04-14),
5. 12274057 - Methods of forming integrated circuit structures comprising isolation structures with different depths (2025-04-08),
6. 12237278 - Active protection circuits for semiconductor devices (2025-02-25),
7. 12112804 - Interleaved string drivers, string driver with narrow active region, and gated LDD string driver (2024-10-08),
8. 12015026 - Methods of forming circuit-protection devices (2024-06-18),
9. 11973031 - Reduced pitch memory subsystem for memory device (2024-04-30),
10. 11901448 - High voltage isolation devices for semiconductor devices (2024-02-13),
11. 11889687 - Integrated circuit structures comprising an isolation structure with different depths (2024-01-30),
12. 11881528 - Transistor with implant screen (2024-01-23),
13. 11837283 - High voltage switch with mitigated gate stress (2023-12-05),
14. 11823731 - Semiconductor device protection circuits, and associated methods, devices, and systems (2023-11-21),
15. 11799038 - Apparatuses including capacitors including multiple dielectric materials, and related methods (2023-10-24),

Title: **The Innovative Contributions of Michael A. Smith**

Introduction

Michael A. Smith is a prominent inventor recognized for his significant contributions to the field of memory devices and circuit protection. Based in Boise, Idaho, he holds an impressive portfolio of 78 patents, showcasing his dedication to innovation and technology.

Latest Patents

Among his latest patents, Michael has developed several key inventions, including interleaved string drivers, a string driver with a narrow active region, and a gated LDD string driver. The memory device associated with these patents features a first and second string driver circuit that are arranged laterally adjacent. The innovative interleaved layout allows for a more efficient pitch length, demonstrating a pivotal advancement in memory subsystem design. Additionally, he has explored methods of forming circuit-protection devices, which involve creating a dielectric with varying thickness over a semiconductor and patterning a conductor to define a control gate for a field-effect transistor.

Career Highlights

Michael A. Smith has worked with renowned companies in the tech industry, such as Micron Technology Incorporated and Intel Corporation. His roles in these organizations have allowed him to apply his inventive skills to real-world applications, contributing to advancements in semiconductor technology.

Collaborations

Throughout his career, Michael has collaborated with notable peers, including Eric Higgins Freeman and Vladimir Mikhalev. These partnerships have facilitated knowledge exchange and fostered innovative ideas, further enriching the field of technology and patents.

Conclusion

Michael A. Smith's work exemplifies the spirit of innovation in the tech industry. His array of patents reflects a commitment to enhancing memory devices and circuit-protection mechanisms, marking him as a significant contributor within this vital sector of technology. His collaborative efforts and professional journey continue to inspire future generations of inventors and technologists.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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