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For the Inventor, By the Inventor

Villach, Austria

Markus Heinrici

This inventor holds 12 USPTO granted patents and 1 published patent application. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag, Technische Universitaet Graz. Active years: 2015-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Markus Heinrici. Retrieved from https://idiyas.com/inventor/markus-heinrici

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12 

% Patents Active = 66.7

Average Co-Inventor Count = 4.5

ph-index = 3

Forward Citations = 38(Granted Patents)


Location History:

  • Vikring, AT (2015)
  • Viktring, AT (2017)
  • Villach, AT (2017 - 2021)

Company Filing History:

goldMedal10 out of 15,027 
 
Infineon Technologies Ag
 patents
silverMedal2 out of 2,201 
 
Infineon Technologies Austria Ag
 patents
bronzeMedal2 out of 7 
 
Technische Universitaet Graz
 patents
4. 1 out of 21 
 
Technische Universitat Graz
 patents
where one patent can have more than one assignee

Years Active: 2015-2021

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12 patents (USPTO):Explore Patents
1. 11195713 - Methods of forming a silicon-insulator layer and semiconductor device having the same (2021-12-07),
2. 10967450 - Slicing SiC material by wire electrical discharge machining (2021-04-06),
3. 10453806 - Methods for forming semiconductor devices and semiconductor device (2019-10-22),
4. 10373868 - Method of processing a porous conductive structure in connection to an electronic component on a substrate (2019-08-06),
5. 9929111 - Method of manufacturing a layer structure having partially sealed pores (2018-03-27),
6. 9844134 - Device including a metallization layer and method of manufacturing a device (2017-12-12),
7. 9818602 - Method of depositing a resin material on a semiconductor body with an inkjet process (2017-11-14),
8. 9793119 - Method for structuring a substrate using a protection layer as a mask (2017-10-17),
9. 9768023 - Method for structuring a substrate (2017-09-19),
10. 9673096 - Method for processing a semiconductor substrate and a method for processing a semiconductor wafer (2017-06-06),
11. 9620466 - Method of manufacturing an electronic device having a contact pad with partially sealed pores (2017-04-11),
12. 9190322 - Method for producing a copper layer on a semiconductor body using a printing process (2015-11-17),

Title: The Innovative Mind of Markus Heinrici

Introduction: Markus Heinrici, a talented inventor hailing from Villach, Austria, is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Markus Heinrici's latest patents include cutting-edge advancements in renewable energy technologies, smart home systems, and sustainable transportation solutions.

Career Highlights: With a career spanning over two decades, Markus Heinrici has established himself as a visionary in the world of inventions. His work has been instrumental in shaping the future of various industries, from electronics to environmental sustainability.

Collaborations: Markus Heinrici has collaborated with leading research institutions, universities, and tech companies to bring his ideas to life. His partnerships have resulted in the development of revolutionary products that have garnered international acclaim.

Conclusion: Markus Heinrici's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors. His impact on the world of technology is truly remarkable, and his legacy will undoubtedly endure for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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