The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2019

Filed:

Nov. 14, 2017
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Joachim Hirschler, Villach, AT;

Christoffer Erbert, St. Magdalen, AT;

Markus Heinrici, Villach, AT;

Mathias Plappert, Drobollach, AT;

Caterina Travan, Villach, AT;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 21/56 (2013.01); H01L 21/565 (2013.01); H01L 23/296 (2013.01); H01L 23/3135 (2013.01); H01L 23/3142 (2013.01); H01L 23/3171 (2013.01);
Abstract

A method for forming a semiconductor device and semiconductor device is disclosed. In one example, the method includes forming a silicone layer on a semiconductor die. The method further includes plasma treating a silicone surface of the silicone layer. A surfactant is deposited on the plasma-treated silicone surface of the silicone layer to obtain a silicone surface at least partly covered by surfactant. A mold is formed on the silicone surface at least partly covered by surfactant. The surfactant includes surfactant molecules comprising an inorganic skeleton terminated by organic compounds.


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