Christoffer Erbert

Title: Christoffer Erbert: Innovator in Semiconductor Technology

Introduction

Christoffer Erbert is a notable inventor based in St. Magdalen, Austria. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Among his latest patents, Christoffer has developed a semiconductor device that includes a bonding pad metal layer structure. This innovative method of manufacturing a semiconductor device involves forming a wiring metal layer structure and a dielectric layer structure arranged directly on it. The bonding pad metal layer structure is also arranged, at least partially, directly on the dielectric layer structure. The layer thickness of the dielectric layer structure ranges from 1% to 30% of the layer thickness of the wiring metal layer structure. This design ensures that the wiring metal layer structure and the bonding pad metal structure are electrically connected through openings in the dielectric layer structure.

Career Highlights

Christoffer has worked with prominent companies in the semiconductor industry, including Infineon Technologies AG and Infineon Technologies Austria AG. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Throughout his career, Christoffer has collaborated with talented individuals such as Joachim Hirschler and Evelyn Napetschnig. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Christoffer Erbert stands out as a key figure in the semiconductor industry, with a strong portfolio of patents that reflect his innovative spirit. His contributions continue to shape the future of semiconductor technology.