The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Nov. 30, 2015
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Martin Mischitz, Wernberg, AT;
Markus Heinrici, Villach, AT;
Barbara Eichinger, Vienna, AT;
Manfred Schneegans, Vaterstaetten, DE;
Stefan Krivec, Arnoldstein, AT;
Assignee:
INFINEON TECHNOLOGIES AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/02 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 21/02203 (2013.01); H01L 23/53238 (2013.01); H01L 2224/0331 (2013.01); H01L 2224/0384 (2013.01); H01L 2224/03505 (2013.01);
Abstract
A method of manufacturing an electronic device may include: forming at least one electronic component in a substrate; forming a contact pad in electrical contact with the at least one electronic component; wherein forming the contact pad includes: forming a first layer over the substrate; planarizing the first layer to form a planarized surface of the first layer; and forming a second layer over the planarized surface, wherein the second layer has a lower porosity than the first layer.