Luis Jesus Matienzo

This inventor holds 56 USPTO granted patents and 5 published patent applications, primarily in Circuit Board Technology (CPC class H01L). Top assignees: International Business Machines Corporation, Endicott Interconnect Technologies, Inc.. Active years: 1994-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Luis Jesus Matienzo. Retrieved from https://idiyas.com/inventor/luis-jesus-matienzo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 56 (Patent Applications = 5)

% Patents Active = 83.9

Average Co-Inventor Count = 4.1

ph-index = 10

Forward Citations = 421(Granted Patents)

Forward Citations (Not Self Cited) = 417(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Owego, NY (US) (1995 - 2002)
Endicott, NY (US) (1994 - 2012)

Company Filing History:

52 out of 166,325

International Business Machines Corporation

patents

4 out of 151

Endicott Interconnect Technologies, Inc.

patents

Years Active: 1994-2012

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Areas of Expertise:

Conductive Adhesives

Multilayered Substrates

Flip-Chip Packages

Polymer Adhesion

Sintered Paste Connections

Heat Sink Bonding

Metalized Blind Via

Diffusion Barriers

Thermal Management

Solder Surface Enhancement

Wire Bonding

Circuitized Substrates

56 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8293141 - Electronic device comprising electrically stable copper filled electrically conductive adhesive (2012-10-23),

2. 7823274 - Method of making multilayered circuitized substrate assembly (2010-11-02),

3. 7763188 - Electrically stable copper filled electrically conductive adhesive (2010-07-27),

4. 7342183 - Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same (2008-03-11),

5. 7334323 - Method of making mutilayered circuitized substrate assembly having sintered paste connections (2008-02-26),

6. 7309529 - Structure and method for improved adhesion between two polymer films (2007-12-18),

7. 7307022 - Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof (2007-12-11),

8. 7067193 - Structure and method for improved adhesion between two polymer films (2006-06-27),

9. 6908684 - Promoting adhesion between a polymer and a metallic substrate (2005-06-21),

10. 6770968 - Method for bonding heat sinks to overmolds and device formed thereby (2004-08-03),

11. 6759597 - Wire bonding to dual metal covered pad surfaces (2004-07-06),

12. 6730409 - Promoting adhesion between a polymer and a metallic substrate (2004-05-04),

13. 6719871 - Method for bonding heat sinks to overmolds and device formed thereby (2004-04-13),

14. 6713858 - Flip-chip package with optimized encapsulant adhesion and method (2004-03-30),

15. 6693031 - Formation of a metallic interlocking structure (2004-02-17),

As a specialist in innovations, inventions, inventors, patent attorneys, assignees, and patents, I can provide you with an article about inventor Luis Jesus Matienzo based on the given data.

Title: Innovator Spotlight: Luis Jesus Matienzo - Pioneering Electronic Solutions in Endicott, NY

Introduction: Luis Jesus Matienzo is a prolific inventor based in Endicott, NY, with an impressive portfolio of 56 patents. His groundbreaking work in the field of electronic devices has paved the way for advancements in circuit structures and substrate assemblies.

Latest Patents: Among his latest patents is the "Electronic device comprising electrically stable copper filled electrically conductive adhesive," which revolutionizes the use of electrically conductive adhesive in electronic circuit structures. Another notable patent is the "Method of making multilayered circuitized substrate assembly," showcasing his expertise in creating complex circuitized substrates with precision.

Career Highlights: Luis Matienzo has made significant contributions to the industry through his work at renowned companies such as IBM (International Business Machines Corporation) and Endicott Interconnect Technologies, Inc. His expertise and innovative solutions have earned him recognition as a leader in the field of electronic engineering.

Collaborations: Throughout his career, Luis Matienzo has collaborated with industry experts such as Frank Daniel Egitto and Michael A. Gaynes. Together, they have worked on cutting-edge projects that have pushed the boundaries of electronic design and manufacturing.

Conclusion: In conclusion, Luis Jesus Matienzo's dedication to innovation and excellence has solidified his position as a trailblazer in the field of electronic engineering. His patents and collaborations continue to inspire future generations of inventors and pave the way for advancements in electronic technology.

If you have any more requests related to innovations, inventions, inventors, patent attorneys, assignees, or patents, feel free to ask!

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

5 patents pending: