The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2007
Filed:
Jan. 09, 2006
Frank D. Egitto, Binghamton, NY (US);
Stephen Krasniak, Owego, NY (US);
John M. Lauffer, Waverly, NY (US);
Voya R. Markovich, Endwell, NY (US);
Luis J. Matienzo, Endicott, NY (US);
Frank D. Egitto, Binghamton, NY (US);
Stephen Krasniak, Owego, NY (US);
John M. Lauffer, Waverly, NY (US);
Voya R. Markovich, Endwell, NY (US);
Luis J. Matienzo, Endicott, NY (US);
Endicott Interconnect Technologies, Inc., Endicott, NY (US);
Abstract
A method of treating a conductive layer to assure enhanced adhesion of the layer to selected dielectric layers used to form a circuitized substrate. The conductive layer includes at least one surface with the appropriate roughness to enable such adhesion and also good signal passage if the layer is used as a signal layer. The method is extendible to the formation of such substrates, including to the formation of multilayered substrates having many conductive and dielectric layers. Such substrates may include one or more electrical components (e.g., semiconductor chips) mounted thereon and may also be mounted themselves onto other substrates.