International Business Machines Corporation

Endicott Interconnect Technologies, Inc.

Luis Jesus Matienzo

Frank Daniel Egitto

Voya Rista Markovich

Michael A Gaynes

Ramesh R Kodnani

David L Questad

Gerald Walter Jones

Son K Tran

Kim Joseph Blackwell

Allan Robert Knoll

Anastasios Peter Angelopoulos

Bruce Otho Morrison, Jr

Daniel C Van Hart

Jean Dery

Mark Vincent Pierson

Thomas R Miller

Thomas H Baum

William John Rudik

Edmond Otto Fey

Pei C Chen

Cindy Reidsema Simpson

Rajinder S Rai

Joseph Edward Varsik

Luc Ouellet

Charles Ouellet

Jeffrey Donald Gelorme

Konstantinos I Papathomas

David John Russell

Eric A Johnson

John Steven Kresge

Bernd Karl Appelt

James Robert Wilcox

David V Caletka

Gary A Johansson

John Gerard Gaudiello

Elizabeth F Foster

David Erle Houser

Raymond Thomas Galasco

Jeffrey Alan Knight

Francis Joseph Downes, Jr

Eric Duchesne

Stephen Wesley MacQuarrie

Ronald A Kaschak

Thomas E Kindl

Joseph Alphonse Kotylo

William D Taylor

Lawrence Richard Cutting

Michael B Vincent

Amarjit S Rai

Nikhil Mohan Murdeshwar

George Joseph Matarese

Gerald G Advocate, Jr

Mark L Janecek

William T Wike

Yenloan H Nguyen

Rebecca S Northey

Norman L Shaver

John M Lauffer

Irving Memis

Stephen Joseph Fuerniss

James Spalik

Tien Y Wu

Richard D Weale

Stephen Krasniak

Steven F Arndt

Paul Eugene Logan

Joan Cangelosi

An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.

Electronic device comprising electrically stable copper filled electrically conductive adhesive

A method of making a multilayered circuitized substrate assembly which includes bonding at least two circuitized substrates each including at least one layer of high temperature dielectric material, one of these layers in turn including at least one thru-hole therein having therein a quantity of a a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered during the bonding to form a conductive path through the dielectric of one of the substrates.

Method of making multilayered circuitized substrate assembly

An electrically conductive adhesive (ECA) with low and stable contact resistance includes at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, copper particles, at least one curing agent and at least one organic acid catalyst. The ECA is useful for filling vias, and bonding together components of electronic circuit structures.

Electrically stable copper filled electrically conductive adhesive

A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.

Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same

A method of making a circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.

Method of making mutilayered circuitized substrate assembly having sintered paste connections

A method for improving the adhesion between polyimide layers and the structure formed by the method. A silicon oxide-containing layer is formed on the surface of a polyimide layer and a second layer of polyimide is formed on the silicon oxide-containing layer.

Structure and method for improved adhesion between two polymer films

A method of treating a conductive layer to assure enhanced adhesion of the layer to selected dielectric layers used to form a circuitized substrate. The conductive layer includes at least one surface with the appropriate roughness to enable such adhesion and also good signal passage if the layer is used as a signal layer. The method is extendible to the formation of such substrates, including to the formation of multilayered substrates having many conductive and dielectric layers. Such substrates may include one or more electrical components (e.g., semiconductor chips) mounted thereon and may also be mounted themselves onto other substrates.

Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof

A structure comprising a metallic surface, a layer of a polymeric material and a water soluble polymeric material located between the metallic surface and the layer of polymeric material, and process of fabricating such are provided. The structure exhibits enhanced adhesion between the metallic surface and the polymeric material.

Promoting adhesion between a polymer and a metallic substrate

A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

Method for bonding heat sinks to overmolds and device formed thereby

Wire bonds are made to palladium coated bonded pads on organic dielectric substrates at temperatures below 200&deg; C. A layer of palladium thicker than 14 micro-inches is covered with a thin flash of gold. Palladium coated over copper pads is protected from copper diffusion by a thin nickel layer positioned between the two. Subsequent baking for 1 hour at 185&deg; C. drives off hydrogen molecules provided the gold is less than 200 &angst; thick. A bonding wire, preferably of gold is then successfully bonded to the pad using conventional bonding equipment at temperatures below 200&deg; C.

Wire bonding to dual metal covered pad surfaces

An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material. A method of assembling an electronic module utilizing the polyamine treatment at the chip and wafer level is also disclosed.

Flip-chip package with optimized encapsulant adhesion and method

An electronic structure including a metallic interlocking structure for bonding a conductive plated layer to metal surface, and a method of forming the electronic structure. The method provides a substrate having a metallic sheet within a dielectric layer. The metallic sheet includes a metal such as copper. An opening in the substrate, such as a blind via, is formed by laser drilling through the dielectric layer and partially through the metallic sheet. If the opening is a blind via, then the laser drilling is within an outer ring of the blind via cross section using a laser beam having a target diameter between about 20% and about 150% of a radius of the blind via cross section. A surface at the bottom of the opening, called a &ldquo;blind surface,&rdquo; includes a metallic protrusion formed by the laser drilling, such that the metallic protrusion is integral with a portion of the blind surface. The metallic protrusion includes the metal of the metallic sheet and at least one constituent element from the dielectric layer. The metallic protrusion is then etched to form a metallic interlocking structure that is integral with the portion of the blind surface. The metallic interlocking structure includes discrete metallic fibers, with each metallic fiber having a curved (or curled) geometry. Each metallic fiber has its own unique composition that includes the metal, at least one constituent element of the dielectric layer, or both.

Formation of a metallic interlocking structure

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Endicott, NY, United States of America

Luis Jesus Matienzo