The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2008

Filed:

Jul. 11, 2005
Applicants:

Frank D. Egitto, Binghamton, NY (US);

Voya R. Markovich, Endwell, NY (US);

Luis J. Matienzo, Endicott, NY (US);

Inventors:

Frank D. Egitto, Binghamton, NY (US);

Voya R. Markovich, Endwell, NY (US);

Luis J. Matienzo, Endicott, NY (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/04 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.


Find Patent Forward Citations

Egitto, Frank. (2008). Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same (U.S. Patent No. 7342183). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7342183

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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