The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2008
Filed:
Jul. 11, 2005
Applicants:
Frank D. Egitto, Binghamton, NY (US);
Voya R. Markovich, Endwell, NY (US);
Luis J. Matienzo, Endicott, NY (US);
Inventors:
Frank D. Egitto, Binghamton, NY (US);
Voya R. Markovich, Endwell, NY (US);
Luis J. Matienzo, Endicott, NY (US);
Assignee:
Endicott Interconnect Technologies, Inc., Endicott, NY (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of making a circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.