logo

For the Inventor, By the Inventor

Carrollton, TX, United States of America

Loi Ngoc Nguyen

This inventor holds 40 USPTO granted patents, primarily in MEMS Technology. Top assignees: Stmicroelectronics Gmbh, Sgs-Thomson Microelectronics Limited, Stmicroelectronics Asia Pacific Pte Limited. Active years: 1994-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Loi Ngoc Nguyen. Retrieved from https://idiyas.com/inventor/loi-ngoc-nguyen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 40

% Patents Active = 95.0

Average Co-Inventor Count = 2.1

ph-index = 7

Forward Citations = 160(Granted Patents)


Location History:

  • Denton, TX (US) (1995)
  • Carollton, TX (US) (2002)
  • Carrollton, TX (US) (1994 - 2014)

Company Filing History:

goldMedal29 out of 2,891 
 
Stmicroelectronics Gmbh
 patents
silverMedal11 out of 816 
 
Sgs-Thomson Microelectronics Limited
 patents
bronzeMedal2 out of 469 
 
Stmicroelectronics Asia Pacific Pte Limited
 patents
where one patent can have more than one assignee

Years Active: 1994-2014

Loading Chart...
Areas of Expertise:
MEMS Packaging
Semiconductor Substrate
Capacitively Coupled MEMS
Integrated Circuit
SRAM Cell Fabrication
Dielectric Structure
Memory Masking
Thin Film Transistor
Contact Structure
Polymers in Vias
EEPROM Cell
Metal Contact
40 patents (USPTO):Explore Patents
1. RE45286 - Embedded microelectromechanical systems (MEMS) semiconductor substrate and related method of forming (2014-12-08),
2. 8853850 - MEMS packaging scheme using dielectric fence (2014-10-07),
3. 8853802 - Method of forming a die having an IC region adjacent a MEMS region (2014-10-07),
4. 8680631 - High aspect ratio capacitively coupled MEMS devices (2014-03-25),
5. 8432006 - High aspect ratio capacitively coupled MEMS devices (2013-04-30),
6. 8405202 - MEMS packaging scheme using dielectric fence (2013-03-26),
7. 8193595 - Method of forming a die having an IC region adjacent a MEMS region (2012-06-05),
8. 8022491 - High aspect ratio all SiGe capacitively coupled MEMS devices (2011-09-20),
9. 7943410 - Embedded microelectromechanical systems (MEMS) semiconductor substrate and related method of forming (2011-05-17),
10. RE41670 - Sram cell fabrication with interlevel Dielectric planarization (2010-09-13),
11. 6812142 - Method and interlevel dielectric structure for improved metal step coverage (2004-11-02),
12. 6661064 - Memory masking for periphery salicidation of active regions (2003-12-09),
13. 6518620 - EEPROM memory cell with increased dielectric integrity (2003-02-11),
14. 6514811 - Method for memory masking for periphery salicidation of active regions (2003-02-04),
15. 6472261 - Method of forming an integrated circuit contact structure having gate electrode protection for self-aligned contacts with zero enclosure (2002-10-29),

Title: Inventor Loi Ngoc Nguyen

Introduction: Loi Ngoc Nguyen is a talented inventor based in Carrollton, TX (US) known for his innovative contributions to various fields.

Latest Patents: Loi Ngoc Nguyen holds several patents in the areas of technology and engineering, showcasing his dedication to pushing the boundaries of innovation.

Career Highlights: Throughout his career, Loi Ngoc Nguyen has demonstrated a keen ability to develop groundbreaking solutions to complex problems, earning him recognition as a leading figure in the inventor community.

Collaborations: Loi Ngoc Nguyen has collaborated with top research institutions and companies to bring his inventions to life, highlighting his commitment to turning ideas into tangible products that make a difference.

Conclusion: In conclusion, Loi Ngoc Nguyen's passion for innovation and his remarkable creativity continue to inspire others in the field of inventing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…