Irvine, CA, United States of America

Liming Tsau

This inventor holds 25 USPTO granted patents and 15 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Broadcom Corporation, Avago Technologies International Sales Pte. Limited, Avago Technologies General IP (Singapore) Pte. Ltd.. Active years: 2002-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Liming Tsau. Retrieved from https://idiyas.com/inventor/liming-tsau

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 72.0

 

Average Co-Inventor Count = 2.3

ph-index = 7

Forward Citations = 142(Granted Patents)


Company Filing History:


Years Active: 2002-2026

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Areas of Expertise:
Microfluidic Channels
Hybrid Bonded Interfaces
Signal Integrity
Integrated Antennas
3D Stacked Die
Power Planes
Photonics Integration
High-Density Capacitors
Dual-Damascene Interconnect
Edge Integrity Detection
Reliability Failures
Integrated Circuit
25 patents (USPTO):Explore Patents

Title: Liming Tsau: Pioneering Innovations in Integrated Circuits and Photonics Integration

Introduction: Liming Tsau is a visionary inventor based in Irvine, CA, with an impressive portfolio of 19 patents that have significantly impacted the fields of integrated circuits and photonics integration. His groundbreaking work has not only revolutionized the semiconductor industry but also paved the way for advancements in optical communication technologies.

Latest Patents: Liming Tsau's latest patents showcase his expertise in developing cutting-edge technologies for integrated circuit packages. One of his notable inventions is the "Integrated circuit package with serpentine conductor and method of making," which optimizes the design of interposers to enhance the flexibility and durability of circuit traces. Another innovative patent is "Photonics integration in semiconductor packages," which demonstrates his proficiency in embedding photonic integrated circuits within substrates for efficient optical signal transmission.

Career Highlights: Liming Tsau has made significant contributions to leading companies in the technology sector, including Broadcom Corporation and Avago Technologies International Sales Pte. Limited. His role in these companies has been instrumental in driving innovation and pushing the boundaries of semiconductor design and packaging.

Collaborations: Throughout his illustrious career, Liming Tsau has collaborated with esteemed professionals in the industry, including Vincent Chen and Henry Chen. These partnerships have led to the development of groundbreaking technologies and have solidified his reputation as a pioneering inventor in integrated circuits and photonics integration.

Conclusion: Liming Tsau's exceptional talent and dedication to innovation have positioned him as a trailblazer in the fields of integrated circuits and photonics integration. His inventive spirit, coupled with his collaborative efforts and industry expertise, continues to shape the future of semiconductor technology and inspire the next generation of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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