The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Aug. 13, 2007
Robert I. Wu, Ladera Ranch, CA (US);
Robert Lutze, Irvine, CA (US);
Jung Kuan Wang, Laguna Niguel, CA (US);
Voon Yean Ten, Nuovo EC, SG;
Liming Tsau, Irvine, CA (US);
Robert I. Wu, Ladera Ranch, CA (US);
Robert Lutze, Irvine, CA (US);
Jung Kuan Wang, Laguna Niguel, CA (US);
Voon Yean Ten, Nuovo EC, SG;
Liming Tsau, Irvine, CA (US);
Broadcom Corporation, Irvine, CA (US);
Abstract
According to one exemplary embodiment, a method for monitoring structural integrity of at least one fuse in semiconductor wafer, which includes at least one electrical monitoring structure, includes forming a monitoring window in a dielectric layer overlying the at least one electrical monitoring structure, where the monitoring window and a fuse window overlying the at least one fuse are, in one embodiment, formed in a same etch process. The method further includes performing at least one electrical measurement on the at least one electrical monitoring structure, wherein the at least one electrical measurement is utilized to monitor the structural integrity of the at least one fuse. A change in the at least one electrical measurement is utilized to indicate a change in the structural integrity of the at least one fuse. The at least one electrical monitoring structure can include, for example, a metal serpentine line and one or more metal combs.