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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10629504 B1

PDFFull Text
Date of Patent:
Apr. 21, 2020

Filed:

May. 03, 2017

Die edge crack and delamination detection

Applicant:

Avago Technologies International Sales Pte. Limited;

Inventors:

Ennis T. Ogawa, Irvine, CA (US);

Yusang Lin, Irvine, CA (US);

Liming Tsau, Irvine, CA (US);

Assignee:

AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED, Singapore, SG;

Attorney:

Xsensus LLP

Primary Examiner:

Patrick Assouad

Assistant Examiner:

Feba Pothen

Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/58 (2006.01); H01L 23/522 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); G01R 31/2858 (2013.01); H01L 21/78 (2013.01); H01L 23/5228 (2013.01); H01L 23/562 (2013.01); H01L 23/585 (2013.01); H01L 2924/3512 (2013.01); H01L 2924/35121 (2013.01);
Abstract

A die edge crack and delamination detection device includes a semiconductor device including an IC active area surrounded by at least one mechanical protection barrier (MPB); one or more metallization layers stacked on the IC active area; a plurality of passive electronic devices placed within the metallization layers at respective predetermined distances from the MPB; and a detection circuit having circuitry. The circuitry is configured to determine a specific metallization layer in which a crack or a delamination is encroaching from an edge of the semiconductor device, determine a lateral distance of a lead end of the crack or the delamination from the MPB, and determine a rate of approach of the crack or the delamination encroaching towards the MPB, via a nominal change in an electrical measurement of at least one of the passive electronic devices.

Find Patent Forward Citations

Ogawa, Ennis. (2020). Die edge crack and delamination detection (U.S. Patent No. 10629504). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10629504

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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