Li-Sheng Weng

Title: The Innovative Contributions of Li-Sheng Weng

Introduction

Li-Sheng Weng is a prominent inventor based in San Diego, California, known for his significant contributions to the field of chip packaging technology. With a total of 17 patents to his name, Weng has made remarkable advancements that enhance the performance and efficiency of electronic devices.

Latest Patents

Among his latest patents, Weng has developed a chip package with core embedded integrated devices. This innovation provides methods for fabricating chip packages that include integrated devices embedded and coupled in series between a lower surface of a package substrate and an integrated circuit die. In some instances, the integrated devices are arranged side by side within a common package substrate. In other configurations, one of the series-coupled integrated devices is embedded in a first package substrate, while another is embedded in a second package substrate that is stacked directly in contact with the first. These integrated devices can be either passive or active. Another notable patent is for a chip package with integrated current control. This design features a power delivery network (PDN) with non-uniform electrical conductance, allowing for a balanced distribution of current flow across the current paths, thus addressing areas of high and low current draw found in conventional designs.

Career Highlights

Weng has had a distinguished career, working with leading technology companies such as Qualcomm Incorporated and Intel Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in the semiconductor industry.

Collaborations

Throughout his career, Weng has collaborated with talented individuals, including Chung-Hao Chen and Yangyang Sun, who have contributed to his projects and innovations.

Conclusion

Li-Sheng Weng's work in chip packaging technology exemplifies the spirit of innovation and creativity in the tech industry. His patents not only advance the field but also pave the way for future developments in electronic device performance.