Company Filing History:

7 out of 5,491

Freescale Semiconductor,inc.

Years Active: 2006-2018

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9 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 10074588 - Semiconductor devices with a thermally conductive layer and methods of their fabrication (2018-09-11),

2. 9614046 - Semiconductor devices with a thermally conductive layer (2017-04-04),

3. 9425161 - Semiconductor device with mechanical lock features between a semiconductor die and a substrate (2016-08-23),

4. 9362198 - Semiconductor devices with a thermally conductive layer and methods of their fabrication (2016-06-07),

5. 9337774 - Packaged RF amplifier devices and methods of manufacture thereof (2016-05-10),

6. 9099567 - Packaged semiconductor devices and methods of their fabrication (2015-08-04),

7. 8310042 - Heatsink moldlocks (2012-11-13),

8. 7701074 - Semiconductor device with a buffer region with tightly-packed filler particles (2010-04-20),

9. 7091602 - Miniature moldlocks for heatsink or flag for an overmolded plastic package (2006-08-15),

Title: L Mali Mahalingam: Innovator in Semiconductor Technology

Introduction

L Mali Mahalingam is a prominent inventor based in Scottsdale, AZ (US). He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on enhancing the performance and efficiency of semiconductor devices.

Latest Patents

Among his latest patents, Mahalingam has developed innovative semiconductor devices featuring a thermally conductive layer. One embodiment of his invention includes a semiconductor substrate that consists of a host substrate and an upper surface, along with an active area. The design incorporates a substrate opening that is partially defined by a recessed surface, with a thermally conductive layer placed over the semiconductor substrate. This layer extends between the recessed surface and a portion of the semiconductor substrate within the active area. The fabrication method for this semiconductor device involves defining an active area, forming a gate electrode over a channel, and creating source and drain electrodes on opposite sides of the gate electrode. The process also includes etching a substrate opening and depositing the thermally conductive layer.

Career Highlights

L Mali Mahalingam has worked with notable companies in the semiconductor industry, including Freescale Semiconductor, Inc. and NXP USA, Inc. His experience in these organizations has allowed him to refine his expertise and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Throughout his career, Mahalingam has collaborated with talented individuals such as Lakshminarayan Viswanathan and Bruce McRae Green. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

L Mali Mahalingam is a distinguished inventor whose work in semiconductor technology has led to significant advancements in the field. His contributions continue to influence the industry and pave the way for future innovations.

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