The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2016

Filed:

Sep. 19, 2014
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Margaret A. Szymanowski, Austin, TX (US);

L. M. Mahalingam, Austin, TX (US);

Sarmad K. Musa, Austin, TX (US);

Fernando A. Santos, Austin, TX (US);

Jerry L. White, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H03F 1/02 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01); H03F 1/42 (2006.01); H03F 3/19 (2006.01); H03F 3/21 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0205 (2013.01); H01L 21/565 (2013.01); H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 25/0652 (2013.01); H03F 1/42 (2013.01); H03F 3/19 (2013.01); H03F 3/211 (2013.01); H01L 2223/6644 (2013.01); H03F 2200/36 (2013.01); H03F 2200/451 (2013.01);
Abstract

An embodiment of a packaged radio frequency (RF) device includes a device substrate with a voltage reference plane, a first input lead coupled to the device substrate, a first output lead coupled to the device substrate, a first transistor die coupled to a top surface of the device substrate with a solder bond, a second die coupled to the top surface of the device substrate with a conductive epoxy that electrically couples at least one component of the second die to the voltage reference plane, and non-conductive molding compound over the top surface of the device substrate and encompassing the first transistor die, the second die, a portion of the first input lead, and a portion of the first output lead.


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