The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2012
Filed:
Jun. 14, 2006
Alexander J. Elliott, Tempe, AZ (US);
L. M. Mahalingam, Scottsdale, AZ (US);
William M. Strom, Chandler, AZ (US);
Alexander J. Elliott, Tempe, AZ (US);
L. M. Mahalingam, Scottsdale, AZ (US);
William M. Strom, Chandler, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A system of mold locks () is formed on a heatsink () of a packaged semiconductor to prevent/mitigate delamination. The mold locks () anchor a plastic mold compound () that forms the protective cover for the packaged semiconductor die. The mold locks () are miniaturized to allow the positioning of them within the flag portion of the heatsink () and leadframe () such that a semiconductor die can be anchored above the mold locks () formed within the flag portion of the heatsink/lead frame (). The miniaturized size of the said moldlocks (do not detract from the purpose of the die attach solder ().