The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2010
Filed:
Sep. 04, 2008
Brian W. Condie, Mesa, AZ (US);
L. M. Mahalingam, Scottsdale, AZ (US);
Mahesh K. Shah, Scottsdale, AZ (US);
Brian W. Condie, Mesa, AZ (US);
L. M. Mahalingam, Scottsdale, AZ (US);
Mahesh K. Shah, Scottsdale, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
An embodiment of a semiconductor device includes a supporting member, a semiconductor die mounted on a portion of the supporting member, a buffer region, and a plastic encapsulation. The buffer region covers a portion of the die, and includes a resin and filler particles packed within the resin. The filler particles have a mix of filler sizes and are tightly packed within the resin. The buffer region has a first dielectric constant and a first loss tangent. The plastic encapsulation encloses at least part of the supporting member and the die. The plastic encapsulation includes a plastic material of a second dielectric constant and a second loss tangent, where the second dielectric constant is larger than the first dielectric constant and the second loss tangent is larger than the first loss tangent.