Company Filing History:
Years Active: 2006-2010
Title: Brian W. Condie: Innovator in Semiconductor Technology
Introduction
Brian W. Condie is a notable inventor based in Mesa, AZ, with a significant contribution to the field of semiconductor technology. He holds a total of 8 patents, showcasing his expertise and innovative spirit in developing advanced semiconductor devices.
Latest Patents
Among his latest patents is a semiconductor device featuring a buffer region with tightly-packed filler particles. This invention includes a supporting member, a semiconductor die, a buffer region, and a plastic encapsulation. The buffer region, which covers part of the die, consists of a resin and filler particles that are tightly packed within the resin. This design aims to enhance the dielectric properties of the device. Another notable patent is for methods and apparatus for a reduced inductance wirebond array. This invention comprises a plurality of signal and ground wires that are interdigitated and parallel, improving the efficiency of semiconductor devices.
Career Highlights
Brian has worked with prominent companies in the semiconductor industry, including Freescale Semiconductor, Inc. and Motorola Corporation. His experience in these organizations has contributed to his development of innovative technologies and solutions in the semiconductor field.
Collaborations
Throughout his career, Brian has collaborated with talented individuals such as Mahesh K. Shah and Lakshminarayan Viswanathan. These collaborations have likely fostered a creative environment that has led to significant advancements in their projects.
Conclusion
Brian W. Condie's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to impact the development of advanced semiconductor devices.