The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Mar. 29, 2006
Mario M. Bokatius, Tempe, AZ (US);
Peter H. Aaen, Phoenix, AZ (US);
Brian W. Condie, Mesa, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A wirebond array () comprising a plurality of signal wiresand a plurality of ground wires () interdigitated with and substantially parallel to the set of signal wires (). In one embodiment, each of the plurality of signal wires () and ground wires () is attached to a first semiconductor device () (e.g., a microwave power device). In another, each of the plurality of signal wires () is further attached to a package lead (). In one embodiment, each of the plurality of ground wires () is further attached to a ground connection region () substantially coplanar with the package lead (). Alternatively, each of the plurality of signal wires () is further attached to a second semiconductor device, wherein each of the plurality of ground wires () is further attached to the second semiconductor device.