The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2008

Filed:

Oct. 24, 2005
Applicants:

Brian W. Condie, Mesa, AZ (US);

Lakshminarayan Viswanathan, Phoenix, AZ (US);

Richard W. Wetz, Chandler, AZ (US);

Inventors:

Brian W. Condie, Mesa, AZ (US);

Lakshminarayan Viswanathan, Phoenix, AZ (US);

Richard W. Wetz, Chandler, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor structure () includes a substrate () having a first surface () with a mold lock feature (). The semiconductor structure also includes a semiconductor chip () located over the first surface of the substrate. The semiconductor structure further includes an electrical isolator structure () located over the first surface of the substrate. The electrical isolator structure includes an electrical lead () and an electrically insulative element () molded to the electrical lead. An optional portion () of the electrical isolator structure is located in the mold lock feature. The semiconductor structure additionally includes an adhesive element () located between and coupling the electrical isolator structure and the first surface of the substrate.


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