Kuo-Yin Lin

This inventor holds 33 USPTO granted patents, primarily in Chemical Mechanical Polishing. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2007-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuo-Yin Lin. Retrieved from https://idiyas.com/inventor/kuo-yin-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 33

% Patents Active = 63.6

Average Co-Inventor Count = 5.6

ph-index = 5

Forward Citations = 73(Granted Patents)

Location History:

Taichung, TW (2007)
Dali, TW (2007)
Hsin-Chu, TW (2018)
Hsinchu County, TW (2017 - 2021)
Jhubei, TW (2007 - 2024)

Company Filing History:

33 out of 43,553

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2007-2024

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Areas of Expertise:

CMP Polishing Head

FinFET Device

CMP Slurry Solution

Wafer Polishing

CMOS Device

BARC-assisted Process

Atomic Layer Deposition

Photonic Performances

Oxide Layer Cleaning

Semiconductor Manufacturing

Hardened Fluid Material

Variable-height Layers

33 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11865666 - CMP polishing head design for improving removal rate uniformity (2024-01-09),

2. 11529712 - CMP polishing head design for improving removal rate uniformity (2022-12-20),

3. 11312882 - CMP slurry solution for hardened fluid material (2022-04-26),

4. 11031391 - Method for manufacturing a FinFET device (2021-06-08),

5. 11011385 - CMP-friendly coatings for planar recessing or removing of variable-height layers (2021-05-18),

6. 10868180 - Method and structure for FinFET devices (2020-12-15),

7. 10774241 - CMP slurry solution for hardened fluid material (2020-09-15),

8. 10714615 - Method and structure for FinFET devices (2020-07-14),

9. 10461080 - Method for manufacturing a FinFET device (2019-10-29),

10. 10279311 - System and method for operating chemical mechanical polishing process (2019-05-07),

11. 10164102 - Method and structure for FinFET devices (2018-12-25),

12. 10160091 - CMP polishing head design for improving removal rate uniformity (2018-12-25),

13. 9954105 - Method and structure for FinFET devices (2018-04-24),

14. 9937536 - Air purge cleaning for semiconductor polishing apparatus (2018-04-10),

15. 9852899 - Wafer back-side polishing system and method for integrated circuit device manufacturing processes (2017-12-26),

Title: The Innovative Journey of Kuo-Yin Lin: Shaping the Future of Technology

Introduction

Kuo-Yin Lin, a visionary inventor based in Jhubei, Taiwan, has made significant contributions to the world of technology with his relentless pursuit of innovation. With a total of 33 patents to his name, Lin stands out as a beacon of inspiration in the realm of inventors.

Latest Patents

Among his latest patents is the groundbreaking CMP polishing head design for improving removal rate uniformity. This invention showcases Lin's knack for designing cutting-edge solutions in the field of chemical mechanical polishing for wafers. The apparatus features a unique retaining ring with varying hardness levels, ensuring enhanced performance and efficiency in wafer polishing processes.

Career Highlights

Currently employed at Taiwan Semiconductor Manufacturing Company Limited (TSMC), Lin continues to push the boundaries of technological advancement. His expertise and dedication have played a pivotal role in driving innovation within the company and the industry as a whole. Through his inventive spirit, Lin has solidified his position as a key player in shaping the future of semiconductor technology.

Collaborations

Lin's innovative journey has been enriched by collaborations with esteemed colleagues such as Teng-Chun Tsai and Shen-Nan Lee. Together, they have fostered a culture of creativity and excellence, leading to the development of groundbreaking technologies and solutions.

Conclusion

In conclusion, Kuo-Yin Lin's remarkable career as an inventor reflects his unwavering commitment to excellence and innovation. His contributions to the field of technology have not only left a lasting impact on the industry but also paved the way for future advancements. Lin's pioneering spirit and inventive prowess continue to inspire the next generation of inventors, shaping the landscape of technology for years to come.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]