The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Nov. 16, 2015
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Te-Chien Hou, Hsin-Chu, TW;
Ching-Hong Jiang, Hsin-Chu, TW;
Kuo-Yin Lin, Jhubei, TW;
Ming-Shiuan She, Hsin-Chu, TW;
Shen-Nan Lee, Jhudong Township, TW;
Teng-Chun Tsai, Hsin-Chu, TW;
Yung-Cheng Lu, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/20 (2012.01); B24B 37/32 (2012.01);
U.S. Cl.
CPC ...
B24B 37/20 (2013.01); B24B 37/32 (2013.01);
Abstract
An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.