Nishishirakawa-gun, Japan

Koichi Kanaya



Average Co-Inventor Count = 2.3

ph-index = 4

Forward Citations = 92(Granted Patents)


Location History:

  • Annaka, JP (1996 - 2001)
  • Gunma, JP (2005 - 2008)
  • Nishishirakawa-gun, JP (2009)
  • Fukushima, JP (2010)
  • Tokyo, JP (2012)
  • Nishigo-mura, JP (2022)

Company Filing History:


Years Active: 1996-2022

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9 patents (USPTO):Explore Patents

Title: Innovations by Koichi Kanaya

Introduction

Koichi Kanaya is a notable inventor based in Nishishirakawa-gun, Japan. He has made significant contributions to the field of silicon wafer technology, holding a total of 9 patents. His work focuses on methods and apparatuses that enhance the evaluation and manufacturing processes of silicon wafers.

Latest Patents

Among his latest patents, Kanaya has developed a method for evaluating the edge shape of silicon wafers. This method involves defining specific shape parameters in a wafer cross-section, allowing for precise measurements of the edge shape. By calculating values based on measurement data, the method effectively prevents potential issues during wafer production. Additionally, he has patented a method for manufacturing polishing pads, which are essential for achieving high flatness in wafers. This method includes slicing urethane foam and applying significant pressure during processing to ensure quality.

Career Highlights

Throughout his career, Koichi Kanaya has worked with prominent companies such as Shin-Etsu Handotai Co., Ltd. and Japan Ade Ltd. His experience in these organizations has contributed to his expertise in silicon wafer technology and innovation.

Collaborations

Kanaya has collaborated with notable colleagues, including Tadahiro Ohmi and Shigetoshi Sugawa. Their combined efforts have further advanced the field of silicon wafer evaluation and manufacturing.

Conclusion

Koichi Kanaya's contributions to silicon wafer technology through his innovative patents and collaborations highlight his importance in the field. His work continues to influence the industry, ensuring advancements in wafer production and quality.

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