The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2010
Filed:
Mar. 09, 2006
Masato Onishi, Fukushima, JP;
Koichi Kanaya, Fukushima, JP;
Masato Onishi, Fukushima, JP;
Koichi Kanaya, Fukushima, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Japan ADE. Ltd., Tokyo, JP;
Abstract
The present invention provides a strip-like holding gripper which holds a semiconductor wafer when measuring a shape of the semiconductor wafer, wherein a side where the semiconductor wafer is held has a round shape, a groove which holds an edge of the semiconductor wafer along a side surface of the round shape portion is provided on the side surface, and the groove comes into contact with the edge of the semiconductor wafer from a periphery of the wafer to hold the semiconductor wafer. As a result, it is possible to provide the gripper, which can stably hold the wafer in a fixed state even if the gripper is inclined when holding the wafer, a holding method, and a shape measuring apparatus.