Method for evaluating edge shape of silicon wafer, apparatus for evaluating thereof, silicon wafer, method for selecting and method for manufacturing thereof

Abstract

A method evaluates an edge shape of a silicon wafer, in which as shape parameters in a wafer cross section, when defining a radial direction reference L, a radial direction reference L, an intersection point P, a height reference plane L, h[μm], h[μm], a point Px, a straight line Lx, an angle θx, a point Px, δ [μm], a point Px, and a radius Rx [μm], the edge shape of the silicon wafer is measured, values of the shape parameters h, h, and δ are set, the shape parameters Rx and θx are calculated in accordance with the definition based on measurement data of the edge shape, and the edge shape of the silicon wafer is determined from the calculated Rx and θx to be evaluated. Consequently, a method evaluates an edge shape of a silicon wafer capable of preventing an occurrence of trouble.